Reflow soldering permanently glues components that are first temporarily stuck to their pads on circuit boards using solder paste that will be melted through hot air or other thermal radiation conduction.
Solder reflow temperature how to#
Generally speaking, even though the same wave soldering equipment is used, different assemblers offer differing manufacturing efficiency due to operation methods and the extent of knowledge about how to operate the machine. Other factors such as speed of the band carrier, wave contact time, etc. In addition, the alloy won't be generated by flux and metal if the temperature is not sufficiently high. If temperature is set too low, flux won't be melted properly, reducing the ability to react and dissolve oxide and dirt on the surface of the metal.
Solder reflow temperature professional#
As far as time and temperature are concerned, a professional wave soldering machine is necessary, while the PCB assembler's expertise and experience are seldom easy to obtain since they depend on application of up-to-date technologies and business focus. A sample wave soldering machine.Īs circuit boards are placed on a pallet ready to go through wave soldering, time and temperature are closely associated with soldering performance. After being cooled to room temperature, the board will be successfully assembled.įigure 2. As temperature reaches the peak in the wave soldering stage, it is reduced, which is called a cooling zone. Wave soldering profile conforms to a temperature curve. Components can be solidly bonded on boards.Ĭooling. As temperature constantly rises, solder paste becomes liquid with a wave formed from the edge boards that travel above. In a pallet along a chain similar to a conveyor belt, circuit boards travel through a heat tunnel to carry out preheating and activate flux. Primary functions of solder flux include eliminating oxide from the metal surface of boards and component pins protecting circuit boards from secondary oxidation during the thermal process reducing surface tension of solder paste and transmitting heat. Solder flux plays a crucial role in smooth implementation of soldering. Cleanliness of metal surfaces is the basic element ensuring soldering performance, depending on functions of solder flux. The wave soldering process is composed of four steps: flux spraying, preheating, wave soldering, and cooling.įlux Spraying. It is carried out in a wave soldering machine (Figure 2). Wave SolderingĪs its name implies, wave soldering is used to combine PCBs and parts through a liquid “wave” formed as the result of motor agitation. Lead or lead-free soldering should be chosen according to specific demands of products for which assembled PCBs will be designed to work. is called lead soldering, while soldering with solder paste without hazardous substances is called lead-free soldering. Soldering with solder paste that contains hazardous substances such as lead, mercury, etc. When it comes to PCB assembly, soldering is applied through solder paste. Soldering is actually a low-temperature brazing, and its filler is called solder. Brazing refers to the process in which two pieces of metal are bonded together by heating and melting filler, or alloy, at a high temperature. Briefly speaking, welding refers to the process in which two similar metals are melted to be bonded together. Prior to formal comparison between wave soldering and reflow soldering, it's of significant necessity to understand differences among soldering, welding, and brazing (Figure 1). The differences among soldering, welding, and brazing. As the leading soldering technologies for assembly, wave soldering and reflow soldering have been most widely applied to high-quality assembly however, the differences between the two technologies continue to confuse many, and when each should be used is also vague. Compared with hand soldering, automatic soldering has been widely selected due to its merits of high accuracy and speed, and the demands of large volume and high cost-effectiveness. Soldering has played an essential role in determining the success of electronic products, since electrical connections derive from precise soldering. The TiMo module conforms to JSTD-020D1 standards for reflow temperatures.As contemporary electronics embrace light weight, increasing efficiency, and high speed, each link of the manufacturing process also conforms to this philosophy, including printed circuit board (PCB) assembly.
It is ultimately the responsibility of the customer to choose the appropriate solder paste and to ensure oven temperatures during reflow meet the requirements of the solder paste. TiMo is a surface mounted device (SMD) designed to be easily integrated into high-volume production lines including reflow soldering to a PCB. Reflow Soldering TiMo reflow soldering specification ¶
0 kommentar(er)
